The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Mar. 03, 2017
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Kohei Sakaike, Yokkaichi, JP;

Toshiyuki Iwamoto, Mie, JP;

Tatsuya Kato, Yokkaichi, JP;

Keisuke Kikutani, Yokkaichi, JP;

Fumitaka Arai, Yokkaichi, JP;

Satoshi Nagashima, Yokkaichi, JP;

Koichi Sakata, Yokkaichi, JP;

Yuta Watanabe, Yokkaichi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11519 (2017.01); H01L 27/11524 (2017.01); H01L 27/11556 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11519 (2013.01); H01L 27/11524 (2013.01); H01L 27/11556 (2013.01);
Abstract

A semiconductor memory device according to an embodiment, includes a first semiconductor member, a second semiconductor member, an insulating member, a plurality of electrode films, a first electrode, and a second electrode. The first semiconductor member and the second semiconductor member are separated in a first direction and extending in a second direction. The second direction crosses the first direction. The insulating member is provided between the first semiconductor member and the second semiconductor member. The plurality of electrode films are arranged to be separated from each other along the second direction. Each of the electrode films surrounds the first semiconductor member, the second semiconductor member, and the insulating member when viewed from the second direction. The first electrode is provided between the first semiconductor member and the electrode film. The second electrode is provided between the second semiconductor member and the electrode film.


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