The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Dec. 13, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Young-seop Shim, Seoul, KR;

Jaehong Kim, Seoul, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/34 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); G11C 16/30 (2006.01); G11C 16/10 (2006.01); H01L 23/528 (2006.01); G11C 16/04 (2006.01); G11C 5/04 (2006.01); G11C 29/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G11C 5/04 (2013.01); G11C 16/0466 (2013.01); G11C 16/0483 (2013.01); G11C 16/10 (2013.01); G11C 16/30 (2013.01); G11C 29/021 (2013.01); H01L 23/49838 (2013.01); H01L 23/528 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A data storage device includes a controller and a multi-stack chip package. A method is used to operate the data storage device. The multi-stack chip package includes a first semiconductor chip arranged on a package substrate, a second semiconductor chip arranged on the first semiconductor chip, and a third semiconductor chip is arranged between the first and second semiconductor chips. The controller can control the first to third semiconductor chips by using a feature parameter measured from each semiconductor chip and a target value that may be originally designed by a memory vendor.


Find Patent Forward Citations

Loading…