The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Jun. 09, 2014
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventor:
Yukio Ikeda, Hitachi, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 33/00 (2006.01); G01R 33/07 (2006.01); G01P 3/487 (2006.01); G01D 5/14 (2006.01); G01D 5/245 (2006.01); G01D 11/24 (2006.01); G01P 3/44 (2006.01); G01L 5/22 (2006.01); G01B 7/30 (2006.01);
U.S. Cl.
CPC ...
G01R 33/072 (2013.01); G01D 5/145 (2013.01); G01D 5/2451 (2013.01); G01D 11/245 (2013.01); G01L 5/221 (2013.01); G01P 3/44 (2013.01); G01P 3/443 (2013.01); G01P 3/487 (2013.01); G01R 33/0052 (2013.01); G01R 33/07 (2013.01);
Abstract
A sensor module includes a magnetic field sensor that includes a sensor main body including a magnetic field sensing element and a plurality of lead wires led out from the sensor main body, a container case including a container part that includes the sensor main body, and a molded body that includes a mold resin molded so as to include at least a part of the container case without contacting with the sensor main body.