The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Mar. 31, 2017
Applicant:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Inventors:
Tianjian Huang, Hillsborough, NJ (US);
Robert Sandilla, Wexford, PA (US);
Daniel Waski, Elmhurst, IL (US);
Kristina Thompson, Clinton, NJ (US);
John Meccia, Ringoes, NJ (US);
Assignee:
HENKEL IP & HOLDING GMBH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 11/08 (2006.01); C09J 131/04 (2006.01); D21H 19/10 (2006.01); D21H 27/36 (2006.01); D21H 11/14 (2006.01); D21H 21/52 (2006.01); B32B 7/12 (2006.01); B32B 3/28 (2006.01); B32B 1/02 (2006.01); D21H 19/54 (2006.01); D21H 21/54 (2006.01); D21H 27/10 (2006.01); D21H 19/24 (2006.01); B65D 81/38 (2006.01); C08K 9/10 (2006.01); C08L 3/02 (2006.01);
U.S. Cl.
CPC ...
C09J 11/08 (2013.01); B32B 1/02 (2013.01); B32B 3/28 (2013.01); B32B 7/12 (2013.01); B65D 81/3858 (2013.01); B65D 81/3874 (2013.01); C09J 131/04 (2013.01); D21H 11/14 (2013.01); D21H 19/10 (2013.01); D21H 19/24 (2013.01); D21H 19/54 (2013.01); D21H 21/52 (2013.01); D21H 21/54 (2013.01); D21H 27/10 (2013.01); D21H 27/36 (2013.01); C08K 9/10 (2013.01); C08L 3/02 (2013.01); C08L 2205/025 (2013.01); C09J 2205/11 (2013.01); C09J 2403/00 (2013.01); C09J 2429/00 (2013.01); C09J 2431/00 (2013.01); Y10T 428/1376 (2015.01); Y10T 428/24711 (2015.01); Y10T 428/249972 (2015.04);
Abstract
An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.