The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Dec. 07, 2016
Applicant:

Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;

Inventors:

So Hyung Lee, Suwon-si, KR;

Keun Bong Do, Suwon-si, KR;

Dong Jin Kim, Suwon-si, KR;

Kang Su An, Suwon-si, KR;

Young Chul Jung, Suwon-si, KR;

Assignee:

SAMSUNG SDI CO., LTD., Yongin-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C23F 11/04 (2006.01); C23F 3/04 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C23F 3/04 (2013.01); C23F 11/04 (2013.01); H01L 21/3212 (2013.01);
Abstract

A CMP slurry composition for polishing a metal wire and a polishing method, the CMP slurry composition including polishing particles; an oxidant; a complexing agent; a corrosion inhibitor; and deionized water, wherein the corrosion inhibitor includes an inorganic nitrite or ammonium nitrate.


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