The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Dec. 11, 2014
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventors:
Hiroshi Okafuji, Otake, JP;
Osamu Kawai, Otake, JP;
Hideto Yamazawa, Otake, JP;
Masahiko Ono, Otake, JP;
Assignee:
Mitsubishi Chemical Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2006.01); C08K 5/109 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); C08L 101/12 (2006.01); B32B 27/08 (2006.01); C08J 5/18 (2006.01); C08L 33/12 (2006.01); G06F 3/044 (2006.01); C08L 33/10 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
C08K 5/109 (2013.01); B32B 7/02 (2013.01); B32B 27/08 (2013.01); B32B 27/30 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/365 (2013.01); C08J 5/18 (2013.01); C08L 33/12 (2013.01); C08L 101/12 (2013.01); G06F 3/044 (2013.01); B32B 2307/21 (2013.01); B32B 2307/408 (2013.01); B32B 2307/412 (2013.01); B32B 2307/558 (2013.01); B32B 2307/7145 (2013.01); B32B 2457/202 (2013.01); B32B 2457/208 (2013.01); C08J 2333/12 (2013.01); C08L 33/10 (2013.01); C08L 2201/10 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); G06F 3/041 (2013.01);
Abstract
A resin composition comprising 100 parts by mass of a polymer (A) and 0.5 parts to 60 parts by mass of a high dielectric material (B), the high dielectric material (B) having a relative dielectric constant at 20° C. of 10 or more, a melting point of 45° C. or lower, and a boiling point of 150° C. or higher.