The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Mar. 16, 2016
Applicant:

Nan Ya Plastics Corporation, Taipei, TW;

Inventors:

Cheng-Chung Lee, Taipei, TW;

Yeong-Tong Hwang, Taipei, TW;

Chen-Hua Wu, Taipei, TW;

Jaou-Shain Yu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 163/04 (2006.01); C08L 63/04 (2006.01); C08G 59/14 (2006.01); C09D 163/00 (2006.01); H05K 1/03 (2006.01); B32B 27/38 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C08G 59/14 (2013.01); C09D 163/00 (2013.01); H05K 1/0373 (2013.01); H05K 1/0237 (2013.01); H05K 2201/012 (2013.01);
Abstract

The invention provides a polyphenylene ether modified phenol-benzaldehyde multifunctional epoxy resin with formula (I) Their manufactured is following steps: polyphenylene ether 100 parts is dissolved in solvent, then phenol-benzaldehyde multifunctional epoxy resin 100˜450 parts and catalyst 0.01˜5 parts are added, stirred and mixed at 90˜180, for 1˜4 hour, to obtain formula (I) solution. Said product is formulated with compositions for laminate, having excellent electrical properties and heat resistance. The dielectric constant is 4.03(1 GHz), dissipation factor is 0.0046(1 GHz) and no delamination longer than 60 minutes dipping in 288soldering test after 2 hours pressure cooking test. Application is insulating materials for highly reliable electronic components such as EMC, PCB substrates, laminate and insulating plates.


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