The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Jul. 10, 2015
Applicants:

Kaneka Corporation, Osaka-shi, Osaka, JP;

Tochigi Kaneka Corporation, Tochigi, JP;

Inventors:

Tsuyoshi Kuman, Tochigi, JP;

Shuzou Imai, Tochigi, JP;

Atsushi Kumasaki, Tochigi, JP;

Masaharu Iwai, Tochigi, JP;

Assignees:

KANEKA CORPORATION, Osaka-Shi, JP;

TOCHIGI KANEKA CORPORATION, Mohka-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); B32B 3/26 (2006.01); B32B 3/30 (2006.01); B32B 15/09 (2006.01); B32B 37/20 (2006.01); B32B 7/02 (2006.01); F16L 59/08 (2006.01); F16L 59/02 (2006.01); F16L 59/065 (2006.01); B32B 5/02 (2006.01); B32B 27/12 (2006.01);
U.S. Cl.
CPC ...
B32B 3/266 (2013.01); B32B 3/30 (2013.01); B32B 5/022 (2013.01); B32B 7/02 (2013.01); B32B 15/09 (2013.01); B32B 27/12 (2013.01); B32B 37/20 (2013.01); F16L 59/029 (2013.01); F16L 59/065 (2013.01); F16L 59/08 (2013.01); B32B 2262/0276 (2013.01); B32B 2307/302 (2013.01); B32B 2307/304 (2013.01); Y10T 156/1007 (2015.01); Y10T 428/24281 (2015.01); Y10T 428/24289 (2015.01);
Abstract

It has been difficult to achieve weight reduction while satisfying a required insulation property in a heat insulating material configured by alternately stacking a metal vapor-deposited sheet and a net. A heat insulating sheet comprises: a first thermal conduction suppressing layer that suppresses thermal conduction; a first radiant heat reflecting layer that is placed on one surface side of the first thermal conduction suppressing layer and reflects radiant heat; and a protruding portion protruding from a surface of the first radiant heat reflecting layer on an opposite side of a surface on which the first thermal conduction suppressing layer is stacked, the protruding portion containing a resin at least on its surface.


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