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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10099413 B1

PDFFull Text
Date of Patent:
Oct. 16, 2018

Filed:

Dec. 01, 2016

Resin-molded component

Applicant:

Koito Manufacturing Co., Ltd., Minato-ku, Tokyo, JP;

Inventors:

Hiroya Ito, Shizuoka, JP;

Takatoshi Inoue, Shizuoka, JP;

Tsukasa Ishiwata, Shizuoka, JP;

Assignee:

KOITO MANUFACTURING., LTD., Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

David Sample

Assistant Examiner:

Donald M Flores, Jr

Int. Cl.
CPC ...
B29C 45/00 (2006.01); B29C 45/16 (2006.01); F21S 41/20 (2018.01); B29K 67/00 (2006.01); B29K 59/00 (2006.01); B29L 31/30 (2006.01); B32B 3/02 (2006.01); B32B 27/08 (2006.01); B29C 45/33 (2006.01); B29L 31/00 (2006.01); B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1671 (2013.01); B29C 45/16 (2013.01); F21S 41/28 (2018.01); B29C 45/14336 (2013.01); B29C 45/1675 (2013.01); B29C 45/33 (2013.01); B29C 2045/1682 (2013.01); B29K 2059/00 (2013.01); B29K 2067/00 (2013.01); B29K 2995/002 (2013.01); B29K 2995/0021 (2013.01); B29K 2995/0025 (2013.01); B29K 2995/0026 (2013.01); B29L 2031/3005 (2013.01); B29L 2031/747 (2013.01); B32B 3/02 (2013.01); B32B 27/08 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2307/41 (2013.01); B32B 2307/412 (2013.01); B32B 2605/08 (2013.01);
Abstract

A resin-molded component includes a first molding part, and a second molding part. A portion of the first molding part and a portion of the second molding part are laminated in a direction of connecting an outer surface and an inner surface of the resin-molded component to provide a laminated portion. A portion of the second molding part is provided as an exposed portion. Each of portions of the laminated portion is located at least on opposite sides across the exposed portion. A one-side surface of the exposed portion in the laminating direction of the laminated portion is configured as a portion of the outer surface and the other-side surface thereof is configured as a portion of the inner surface.

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