The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Jun. 18, 2013
Applicant:

Endress + Hauser Gmbh + Co. KG, Maulburg, DE;

Inventors:

Andreas Rossberg, Bad Sackingen, DE;

Elke Schmidt, Bad Sackingen, DE;

Dietmar Birgel, Schopfheim, DE;

Assignee:

ENDRESS+HAUSER SE+CO.KG, Maulburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01);
U.S. Cl.
CPC ...
B23K 31/02 (2013.01); B23K 1/0016 (2013.01); H05K 3/3431 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/2036 (2013.01); Y02P 70/613 (2015.11); Y10T 403/479 (2015.01);
Abstract

A method for connecting a component to a support via soldering between a first contact surface of the component and a second contact surface of the support. The method is distinguished by features including that at least one spacer is embodied in such a manner and arranged between the first contact surface and the second contact surface that the first contact surface and the second contact surface are spaced from one another, and that the soldering is executed in such a manner that the component and the support are connected with one another via the first contact surface and the second contact surface. Also claimed is a component connectable with a support via soldering is intended.


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