The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Nov. 18, 2016
Applicant:
Capitalbio Corporation, Beijing, CN;
Inventors:
Lei Wang, Beijing, CN;
Xinying Zhou, Beijing, CN;
Li Ma, Beijing, CN;
Juan Xin, Beijing, CN;
Mingxian Lin, Beijing, CN;
Jinhai Feng, Beijing, CN;
Assignee:
CAPITALBIO CORPORATION, Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B81C 3/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B81C 3/001 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0803 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01);
Abstract
In one aspect, disclosed herein are methods for packaging biochips, including microfluidic chips. The method can comprise bonding a substrate and a cover slide, packaging the bonded chip, creating a vacuum in the package, and applying a pressure on the packaged chip. The method is particularly useful for minimizing bubble formation during low-cost and mass production of microfluidic chips.