The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Apr. 02, 2015
Applicant:

Uchicago Argonne, Llc, Chicago, IL (US);

Inventors:

Vojislav Stamenkovic, Naperville, IL (US);

Nenad Markovic, Hinsdale, IL (US);

Yijin Kang, Naperville, IL (US);

Assignee:

UChicago Argonne, LLC, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 23/89 (2006.01); B01J 37/08 (2006.01); B01J 21/18 (2006.01); B01J 35/00 (2006.01); B01J 35/02 (2006.01); B01J 37/16 (2006.01); B82Y 40/00 (2011.01); B01J 37/02 (2006.01); H01M 4/86 (2006.01); H01M 4/92 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B01J 23/892 (2013.01); B01J 21/18 (2013.01); B01J 35/008 (2013.01); B01J 35/0013 (2013.01); B01J 35/0033 (2013.01); B01J 37/08 (2013.01); B01J 37/16 (2013.01); B01J 37/0211 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); H01M 4/8657 (2013.01); H01M 4/92 (2013.01); Y10S 977/773 (2013.01); Y10S 977/892 (2013.01);
Abstract

A multimetallic core/interlayer/shell nanoparticle comprises an inner core formed from a first metal. An interlayer is disposed on the first layer. The interlayer includes a plurality of gold atoms. An outer shell is disposed over the interlayer. The outer shell includes platinum and the first metal. A surface of the NP is substantially free of gold. The first metal is selected from the group consisting of nickel, titanium, chromium, manganese, iron, cobalt, copper, vanadium, yttrium, ruthenium, palladium, scandium, tin, lead and zinc.


Find Patent Forward Citations

Loading…