The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Aug. 14, 2015
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Robyn Rebecca Reed McLaughlin, Seattle, WA (US);

Jeffrey Taylor Stellman, San Francisco, CA (US);

Andrew Hill, Redmond, WA (US);

Paul Bornemann, North Bend, WA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); H05K 7/20 (2006.01); H01L 23/367 (2006.01); F28D 15/02 (2006.01); F28F 3/04 (2006.01); H01L 23/427 (2006.01); H01L 23/467 (2006.01); B23P 15/26 (2006.01); F28D 21/00 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20336 (2013.01); F28D 15/0233 (2013.01); F28D 15/0275 (2013.01); F28F 3/044 (2013.01); F28F 3/046 (2013.01); H01L 23/3672 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); B23P 15/26 (2013.01); F28D 2021/0028 (2013.01); F28D 2021/0029 (2013.01); H01L 21/4882 (2013.01); H01L 23/3677 (2013.01); H01L 25/0655 (2013.01);
Abstract

Heat dissipation configurations and methods are described herein. A heat dissipation apparatus may include an individual piece of metal having a thermally conductive metal surface. The metal surface includes a plurality of ridges or protrusions extending from a base of the metal surface, wherein an air flow channel is provided between each two adjacent protrusions, therein providing a plurality of air flow channels. The apparatus is configured to dissipate heat for an electronic device having an active cooling source directing air through the plurality of air flow channels. In some examples, the heat dissipation apparatus is a vapor chamber, and the surface includes a section having a trough and a raised area or platform surrounded by the trough, wherein the raised area is configured to contact a microprocessor die in communication with the vapor chamber.


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