The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Oct. 19, 2015
Murata Manufacturing Co., Ltd., Kyoto, JP;
Masaki Kawata, Kyoto, JP;
Yuki Ito, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A method of manufacturing a resin multilayer substrate is provided in which a component () is incorporated in a stacked body obtained by stacking a plurality of thermoplastic resin sheets (). The method includes the steps of: softening a first resin sheet () by heating, and pressing the component () against the first resin sheet (), thereby fixing the component () to the first resin sheet (); stacking the first resin sheet () on a second resin sheet () having a through hole () receiving the component () and a third resin sheet () located adjacent to a lower side of the component () such that the component () is inserted into the through hole () and the lower surface of the component () faces the third resin sheet (); and performing compression bonding by heating and pressurizing the stacked body including these resin sheets ().