The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Apr. 22, 2014
Applicant:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Inventors:

Shintaro Yamamichi, Kanagawa, JP;

Hirokazu Honda, Kanagawa, JP;

Masaki Watanabe, Kanagawa, JP;

Junichi Arita, Kanagawa, JP;

Norio Okada, Kanagawa, JP;

Jun Ueno, Kanagawa, JP;

Masashi Nishimoto, Kanagawa, JP;

Michitaka Kimura, Kanagawa, JP;

Tomohiro Nishiyama, Kanagawa, JP;

Assignee:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 1/38 (2015.01); H04B 1/40 (2015.01); H04W 84/18 (2009.01);
U.S. Cl.
CPC ...
H04W 84/18 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/49111 (2013.01);
Abstract

A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device).


Find Patent Forward Citations

Loading…