The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Feb. 02, 2017
Applicant:

Mercury Systems, Inc., Andover, MA (US);

Inventors:

Darryl J. McKenney, Londonderry, NH (US);

Absu Methratta, Waltham, MA (US);

Erica Ouellette, Boxboro, MA (US);

Assignee:

MERCURY SYSTEMS, INC., Andover, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/58 (2011.01); H05K 1/02 (2006.01); H01R 12/71 (2011.01); H01R 13/652 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H01R 12/00 (2006.01); H05K 3/30 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01R 12/58 (2013.01); H01R 9/091 (2013.01); H01R 12/716 (2013.01); H01R 13/652 (2013.01); H05K 1/0213 (2013.01); H05K 1/0237 (2013.01); H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/308 (2013.01); H05K 3/34 (2013.01); H05K 1/184 (2013.01); H05K 3/421 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/1078 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10803 (2013.01); H05K 2201/10878 (2013.01); H05K 2201/10901 (2013.01);
Abstract

According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.


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