The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Nov. 25, 2015
Applicant:
Melexis Technologies NV, Tessenderlo, BE;
Inventors:
Carl Van Buggenhout, Aalst, BE;
Appolonius Jacobus Van Der Wiel, Duisburg, BE;
Luc Buydens, Kasterlee, BE;
Assignee:
MELEXIS TECHNOLOGIES NV, Tessenderlo, BE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); B81B 7/02 (2006.01); G01J 5/12 (2006.01); H01L 31/0203 (2014.01); G01J 5/04 (2006.01); G01J 5/08 (2006.01); G01J 1/02 (2006.01); G01J 5/02 (2006.01); G01J 5/06 (2006.01); G01J 1/42 (2006.01); H01L 31/0216 (2014.01); H01L 27/144 (2006.01); H01L 31/09 (2006.01); H01L 35/28 (2006.01); H01L 35/34 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); B81B 7/02 (2013.01); G01J 1/0214 (2013.01); G01J 1/0295 (2013.01); G01J 1/4228 (2013.01); G01J 5/024 (2013.01); G01J 5/0225 (2013.01); G01J 5/0285 (2013.01); G01J 5/045 (2013.01); G01J 5/06 (2013.01); G01J 5/0803 (2013.01); G01J 5/12 (2013.01); H01L 27/144 (2013.01); H01L 27/1443 (2013.01); H01L 31/02164 (2013.01); H01L 31/09 (2013.01); H01L 35/28 (2013.01); H01L 35/34 (2013.01); B81B 2201/0207 (2013.01); B81B 2203/0315 (2013.01); G01J 2005/068 (2013.01);
Abstract
A chip for radiation measurements, the chip comprising a first substrate comprising a first sensor and a second sensor. The chip moreover comprises a second substrate comprising a first cavity and a second cavity both with oblique walls. An internal layer is present on the inside of the second cavity. The second substrate is sealed to the first substrate with the cavities on the inside such that the first cavity is above the first sensor and the second cavity is above the second sensor.