The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

May. 04, 2016
Applicant:

Magnachip Semiconductor, Ltd., Cheongju-si, KR;

Inventors:

Kwang Ho Na, Seongnam-si, KR;

Seung Wook Song, Cheongju-si, KR;

Yong Hun Kim, Goryeong-gun, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 29/10 (2006.01); H01L 29/08 (2006.01); H01L 29/417 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7397 (2013.01); H01L 29/0696 (2013.01); H01L 29/0847 (2013.01); H01L 29/1095 (2013.01); H01L 29/407 (2013.01); H01L 29/41741 (2013.01); H01L 29/4236 (2013.01); H01L 29/42376 (2013.01);
Abstract

A power semiconductor device includes a semiconductor substrate, trench structures comprising a first, a second, a third and a fourth trench structure formed in the substrate, a second conductivity type body region formed between the trench structures, a first conductivity type source region formed in the second conductivity type body region, and an emitter electrode and a gate pad formed over the substrate, wherein each trench structure includes a top electrode and a bottom electrode, and each top electrode is insulated from the corresponding bottom electrode, and wherein the first trench structure is symmetric to the fourth trench structure, and the second trench structure is symmetric to the third trench structure, and wherein the first trench structure is not identical to the second trench structure, and wherein no first conductivity type source region is formed to be adjacent to the second trench structure and the third trench structure.


Find Patent Forward Citations

Na, Kwang. (2018). Power semiconductor device comprising trench structures (U.S. Patent No. 10096700). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10096700

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…