The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
May. 17, 2017
Applicant:
Sony Corporation, Tokyo, JP;
Inventor:
Hironobu Abe, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/205 (2006.01); H01L 33/00 (2010.01); H01L 21/00 (2006.01); H01L 27/32 (2006.01); H01L 33/62 (2010.01); H01L 23/48 (2006.01); G02F 1/1345 (2006.01); H05K 1/02 (2006.01); H01L 51/00 (2006.01); H05K 3/36 (2006.01); H01L 27/12 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3276 (2013.01); G02F 1/13452 (2013.01); H01L 23/48 (2013.01); H01L 33/62 (2013.01); H01L 51/0097 (2013.01); H05K 1/0271 (2013.01); H05K 3/36 (2013.01); H05K 3/361 (2013.01); H01L 27/1218 (2013.01); H05K 3/323 (2013.01); H05K 2201/10136 (2013.01);
Abstract
There are provided a semiconductor unit that prevents connection failure caused by a wiring substrate to improve reliability, a method of manufacturing the semiconductor unit, and an electronic apparatus including the semiconductor unit. The semiconductor unit includes: a device substrate including a functional device and an electrode; a first wiring substrate electrically connected to the functional device through the electrode; and a second wiring substrate electrically connected to the functional device through the first wiring substrate.