The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Apr. 13, 2017
Applicant:

Heptagon Micro Optics Pte. Ltd., Singapore, SG;

Inventors:

Stephan Heimgartner, Passugg, CH;

Alexander Bietsch, Thalwil, CH;

Hartmut Rudmann, Jona, CH;

Markus Rossi, Jona, CH;

Simon Gubser, Weesen, CH;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 27/146 (2006.01); G02B 13/00 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); G02B 21/36 (2006.01); H01L 31/054 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14687 (2013.01); G02B 13/0085 (2013.01); G02B 21/367 (2013.01); H01L 27/14618 (2013.01); H01L 27/14623 (2013.01); H01L 27/14625 (2013.01); H01L 27/14632 (2013.01); H01L 27/14685 (2013.01); H01L 31/0203 (2013.01); H01L 31/02325 (2013.01); H01L 31/0547 (2014.12); H01L 2924/0002 (2013.01); Y02E 10/52 (2013.01); Y10T 428/24273 (2015.01); Y10T 428/24322 (2015.01); Y10T 428/24331 (2015.01);
Abstract

A method for manufacturing one or more optical devices, each comprising a first member and a second member, and a spacer arranged between the first and second members. The method includes manufacturing a spacer wafer including a multitude of the spacers. Manufacturing the spacer wafer includes providing a replication tool having spacer replication sections; bringing the replication tool in contact with a first surface of another wafer; bringing a vacuum sealing chuck into contact with a second surface of the other wafer while the other wafer remains in contact with the replication tool; and injecting a liquid, viscous or plastically deformable material through an inlet of the vacuum sealing chuck so as to substantially fill the spacer replication sections.


Find Patent Forward Citations

Loading…