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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10096585 B1

PDFFull Text
Date of Patent:
Oct. 09, 2018

Filed:

Mar. 01, 2017

Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer

Applicant:

Toyoda Gosei Co., Ltd., Kiyosu-shi, JP;

Inventors:

Motoyuki Tanaka, Kiyosu, JP;

Yosuke Tsuchiya, Kiyosu, JP;

Aya Kawaoka, Kiyosu, JP;

Makoto Ishida, Kiyosu, JP;

Assignee:

TOYODA GOSEI CO., LTD., Kiyosu-Shi, Aichi-Ken, JP;

Attorney:

McGinn I.P. Law Group, PLLC.

Primary Examiner:

Stephen Bradley

Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 25/00 (2006.01); H01L 33/48 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 25/0756 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01);
Abstract

A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.

Find Patent Forward Citations

Tanaka, Motoyuki. (2018). Method of manufacturing light emitting element and light emitting device including forming resin film including phosphor containing layer (U.S. Patent No. 10096585). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10096585

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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