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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10096572 B1

PDFFull Text
Date of Patent:
Oct. 09, 2018

Filed:

Dec. 02, 2015

Power semiconductor module and electric power steering apparatus using the same

Applicant:

Nsk Ltd., Tokyo, JP;

Inventors:

Shigeru Shimakawa, Tokyo, JP;

Takashi Sunaga, Tokyo, JP;

Takaaki Sekine, Tokyo, JP;

Assignee:

NSK LTD., Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Bickey Dhakal

Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H02M 7/5387 (2007.01); H02P 27/08 (2006.01); H02P 6/28 (2016.01); B62D 5/04 (2006.01); H01L 23/50 (2006.01); H01L 23/14 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); B62D 5/04 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H02M 7/53871 (2013.01); H02P 6/28 (2016.02); H02P 27/08 (2013.01); H01L 23/13 (2013.01); H01L 23/14 (2013.01); H01L 23/50 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48141 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49112 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01);
Abstract

A power semiconductor module that comprises plural arrangements of power semiconductor elements comprising a power semiconductor bare chip which one electrode portion thereof is connected to a metal plate which at least one external connecting terminal is formed and other external connecting terminals which are electrically connected to other electrode portions of the power semiconductor bare chip, and that are contained in a same package, comprises wherein the power semiconductor elements are basically same outline, electrodes of the bare chip of the power semiconductor elements are mutually connected between the power semiconductor elements with a metal connector or a wiring, and the package is a resin mold package that seals the power semiconductor elements with an electrical insulating resin.

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