The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Jul. 14, 2016
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Le Liang, Taoyuan, TW;

Kai Lu, Taoyuan, TW;

Zhen-Qing Zhao, Taoyuan, TW;

Zeng Li, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 23/3114 (2013.01); H01L 23/49838 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15747 (2013.01);
Abstract

A power module package includes a single-layered circuit board, a first electronic component, and a second electronic component. The single-layered circuit board includes an insulating substrate and a conductive layer thereon. A bottom surface of the conductive layer touches a top surface of the insulating substrate. The insulating substrate has plural first openings to allow the conductive layer to be exposed from the bottom surface of the insulating substrate. The first electronic component is disposed on a top surface of the conductive layer. The second electronic component is disposed on the bottom surface of the insulating substrate and received in the first openings. The second electronic component is connected to the conductive layer via the first openings. At least one of the first electronic component and the second electronic component is a bare die.


Find Patent Forward Citations

Loading…