The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Aug. 16, 2017
Em Microelectronic-marin SA, Marin, CH;
Christoph Kuratli, Guemmenen, CH;
Yves Dupraz, Valeyres-sous-Montagny, CH;
EM Microelectronic-Marin SA, Marin, CH;
Abstract
An integrated circuit die having at least two bond pads, a redistribution layer, the redistribution layer including at least one solder pad including comprising two portions arranged to enable an electrical connection between each other by a same solder ball placed on the solder pad, but electrically isolated of each other in the absence of a solder ball on the solder pad at least two redistribution wires, each one connecting one of the two portions to one of the two bond pads, a first bond pad connected via a first redistribution wire to a first portion of the solder pad being dedicated to digital ground and a second bond pad connected via a second redistribution wire to a second portion of the solder pad being dedicated to analog ground.