The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Aug. 29, 2017
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
A fan-out semiconductor package includes: a first semiconductor chip; a first encapsulant; a connection member including first vias and a first redistribution layer; a second semiconductor chip; a second encapsulant; a second redistribution layer; second vias; and third vias. A length of the longest side of a first cut surface of the second via is less than that of the longest side of a second cut surface of the third via, the first cut surface of the second via and the second cut surface of the third via being cut by a plane on any level parallel to the second active surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile