The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Apr. 12, 2017
Applicant:

Abb Schweiz Ag, Baden, CH;

Inventors:

Bruno Agostini, Zürich, CH;

Daniele Torresin, Birmenstorf, CH;

Francesco Agostini, Zürich, CH;

Mathieu Habert, Rixheim, FR;

Munaf Rahimo, Uezwil, CH;

Assignee:

ABB Schweiz AG, Baden, CH;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 29/16 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H05K 7/20 (2006.01); F25B 25/00 (2006.01); H01L 23/473 (2006.01); H01L 29/20 (2006.01); H01L 29/32 (2006.01); H01L 29/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); F25B 25/005 (2013.01); H01L 23/473 (2013.01); H01L 29/1608 (2013.01); H01L 29/7393 (2013.01); H01L 29/78 (2013.01); H05K 7/20936 (2013.01); H01L 29/2003 (2013.01); H01L 29/22 (2013.01);
Abstract

A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100° C.


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