The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Dec. 22, 2015
Applicant:

National Kaohsiung University of Applied Sciences, Kaohsiung, TW;

Inventors:

Chung-Nan Chen, New Taipei, TW;

Chih-Chun Chen, Taichung, TW;

Chun-Hao Chen, Kaohsiung, TW;

Wen-Chie Huang, Hualien County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/00 (2006.01); G01K 3/00 (2006.01); G01K 7/24 (2006.01);
U.S. Cl.
CPC ...
G01K 7/24 (2013.01);
Abstract

A thermal sensing device comprises a substrate, a first insulating layer, at least one first sensing resistor, at least one second sensing resistor, a plurality of etching holes and a cavity. The first insulating layer is disposed on the substrate. The first sensing resistor is disposed above the first insulating layer. The second sensing resistor is disposed above the first insulating layer and isolated from the at least one first sensing resistor. The etching holes are disposed around the at least one first sensing resistor and the at least one second sensing resistor. The cavity is formed below the at least one first sensing resistor and the at least one second sensing resistor. The thermal sensing device is implemented in a measurement circuit to improve the problem that the signal becomes smaller when the sensing element is minimized.


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