The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Apr. 22, 2015
Applicants:

Ngk Insulators, Ltd., Nagoya, JP;

The University of Electro-communications, Chofu, JP;

Inventors:

Hiromi Miura, Machida, JP;

Naokuni Muramatsu, Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C22F 1/08 (2006.01); H01B 1/02 (2006.01); H01B 13/00 (2006.01); C22F 1/00 (2006.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); C22F 1/08 (2013.01); H01B 1/026 (2013.01); H01B 13/0016 (2013.01); C22F 1/00 (2013.01);
Abstract

A Cu—Be alloy according to the present invention is a Co-containing Cu—Be alloy, in which the Co content is 0.005% to 0.12% by mass, and the number of Cu—Co-based compound particles having a particle size of 0.1 μm or more that can be confirmed on a TEM image at a magnification of 20,000 is five or less in a field of view of 10 μm×10 μm. Furthermore, a method for producing a Cu—Be alloy according to the present invention includes a solution annealing treatment step of subjecting a Cu—Be alloy raw material containing 0.005% to 0.12% by mass of Co and 1.60% to 1.95% by mass of Be to solution annealing treatment to obtain a solution-annealed material.


Find Patent Forward Citations

Loading…