The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Nov. 12, 2015
Matsumoto Yushi-seiyaku Co., Ltd., Yao-shi, Osaka, JP;
Sachiko Tokumura, Yao, JP;
MATSUMOTO YUSHI-SEIYAKU CO., LTD., Osaka, JP;
Abstract
Heat-expandable microspheres including a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is produced by polymerizing a polymerizable component containing (A) a nitrile monomer including acrylonitrile and methacrylonitrile, (B) a carboxyl-group-containing monomer, and (C) a monomer copolymerizable with the nitrile monomer (A) and the carboxyl-group-containing monomer (B). Further, the amount of the acrylonitrile in the nitrile monomer (A) ranges from 0.1 to 9 wt % based on the nitrile monomer (A). Also disclosed are hollow particles manufactured by heating and expanding the heat-expandable microspheres; a composition containing a base compound and at least one particulate material selected from the heat-expandable microspheres and the hollow particles; and a formed product manufactured by molding or applying a coat of the composition.