The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Jun. 02, 2016
Applicant:
Cytec Industrial Materials (Derby) Limited, Heanor, Derbyshire, GB;
Inventor:
Ian Aspin, Derbyshire, GB;
Assignee:
Cytec Industrial Materials (Derby) Limited, Heanor, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/26 (2006.01); B32B 27/04 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01); C08J 5/04 (2006.01); C08G 59/56 (2006.01); C08K 3/04 (2006.01); C08K 7/06 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08G 59/5073 (2013.01); C08G 59/5026 (2013.01); C08G 59/56 (2013.01); C08J 5/04 (2013.01); C08J 5/042 (2013.01); C08J 5/24 (2013.01); C08K 3/04 (2013.01); C08K 7/06 (2013.01); C08J 2363/00 (2013.01);
Abstract
Disclosed herein is an epoxy resin compositions comprising an epoxy component and a curing agent component, wherein the curing agent component is at least an aminoalkylimidazole curing agent, and wherein the epoxy component and the curing agent component react together at a temperature of about 100° C. to about 130° C. to form a substantially cured reaction product in about 10 minutes or less. Further disclosed are composite products formed from such epoxy resin compositions.