The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Dec. 30, 2015
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Kenta Tsujie, Kanagawa, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 17/00 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); C22C 9/00 (2006.01); B23K 103/12 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 1/19 (2013.01); C22C 9/00 (2013.01); B23K 2203/12 (2013.01);
Abstract
There is provided a titanium-copper alloy in which the adhesion strength with solder can be increased. The titanium-copper alloy comprises a base material and a plating layer provided on a surface of the base material, wherein the base material contains 1.5 to 5.0% by mass of Ti with a balance consisting of copper and unavoidable impurities, and the plating layer is selected from the group consisting of a Ni plating layer, a Co plating layer, and a Co—Ni alloy plating layer.