The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Dec. 14, 2015
Applicant:

Novartis Ag, Basel, CH;

Inventors:

Michael F. Mattes, Arlington, TX (US);

Mark A. Zielke, Fort Worth, TX (US);

Assignee:

Novartis AG, Basel, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); A61F 2/16 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/40 (2006.01); A61N 1/375 (2006.01); A61N 1/36 (2006.01); B29D 11/00 (2006.01); G02C 7/08 (2006.01); B29D 11/02 (2006.01);
U.S. Cl.
CPC ...
A61F 2/1624 (2013.01); A61N 1/36046 (2013.01); A61N 1/3754 (2013.01); B29D 11/00807 (2013.01); B29D 11/00817 (2013.01); B29D 11/00826 (2013.01); B29D 11/023 (2013.01); G02C 7/083 (2013.01); H05K 3/007 (2013.01); H05K 3/28 (2013.01); H05K 3/4038 (2013.01); A61F 2/16 (2013.01); A61F 2002/1681 (2013.01); A61F 2220/0025 (2013.01); A61F 2250/0069 (2013.01);
Abstract

An electronic device can comprise a first electronic module; a second electronic module; and a hermetic electric interconnect to hermetically couple them. The hermetic electric interconnect can comprise a bottom metal layer; a bottom insulating layer, deposited on the bottom metal layer to insulate the bottom metal layer; an interconnect metal layer, deposited on the bottom insulating layer, and deposited to form a bottom sealing ring; and patterned to form electrical connections between contact pads, and to form a middle sealing ring; a patterned top insulating layer, deposited on the interconnect metal layer to insulate the interconnect metal layer; and patterned to form feedthrough holes; and a top metal layer, deposited on the top insulating layer to start forming contacts by filling the feedthrough holes; and patterned to complete forming contacts through the feedthrough holes, to form a separate barrier layer, and to complete forming the top sealing ring.


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