The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Feb. 02, 2016
Applicant:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Inventors:

Xing Lan, Huntington Beach, CA (US);

Daniel R. Scherrer, Glendale, CA (US);

Jesse B. Tice, Torrance, CA (US);

Patrick J. Case, Culver City, CA (US);

Xianglin Zeng, Monterey Park, CA (US);

Assignee:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H03B 5/12 (2006.01); H03H 1/00 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); B05D 5/12 (2006.01); B05D 1/12 (2006.01); B41J 2/01 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H01L 21/4867 (2013.01); H01L 23/5382 (2013.01); H03B 5/12 (2013.01); H03H 1/00 (2013.01); B05D 1/12 (2013.01); B05D 5/12 (2013.01); B41J 2/01 (2013.01); H03B 2200/0014 (2013.01); H03H 2001/0021 (2013.01); H03H 2210/03 (2013.01);
Abstract

A method of manufacturing electronics using a nanoparticle ink printing method includes: synthesizing a phase change material (PCM) ink composition using hot injection to develop nanoparticles of the PCM; suspending the nanoparticles with a solvent; and printing a reconfigurable component using the PCM ink composition in additive manufacturing. Electronics includes: a substrate layer; an insulator layer printed on top of the substrate layer; a heater layer printed on top of the insulator layer; a barrier layer printed on top of one or more of the insulator layer and the heater layer; a phase change material (PCM) printed on top of the barrier layer; a connectivity layer printed on top of the PCM; and a passivation layer printed on top of one or more of the PCM and the connectivity layer.


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