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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10091883 B1

PDFFull Text
Date of Patent:
Oct. 02, 2018

Filed:

Jun. 19, 2014

Dielectric filmless electronic module and method for manufacturing same

Applicant:

Gemalto SA, Meudon, FR;

Inventors:

Stéphane Ottobon, La Ciotat, FR;

Lucile Dossetto, La Ciotat, FR;

Line Degeilh, La Ciotat, FR;

Assignee:

GEMALTO SA, Meudon, FR;

Attorney:

Buchanan Ingersoll & Rooney PC

Primary Examiner:

Binh Tran

Int. Cl.
CPC ...
H05K 5/02 (2006.01); H05K 1/18 (2006.01); G06K 19/077 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01); H05K 7/18 (2006.01); H01R 9/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/495 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); G06K 19/07747 (2013.01); H05K 1/032 (2013.01); H05K 1/112 (2013.01); H05K 1/189 (2013.01); H05K 3/32 (2013.01); H05K 3/4007 (2013.01); H01L 21/4821 (2013.01); H01L 23/495 (2013.01); H01L 23/49541 (2013.01); H01L 23/49579 (2013.01); H01L 23/49866 (2013.01); H01L 33/62 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/181 (2013.01); H05K 1/0393 (2013.01);
Abstract

The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.

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