The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Mar. 19, 2018
Applicant:

Sumitomo Osaka Cement Co., Ltd, Tokyo, JP;

Inventors:

Toshio Kataoka, Tokyo, JP;

Kei Katou, Tokyo, JP;

Assignee:

SUMITOMO OSAKA CEMENT CO., LTD., Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); H01R 12/62 (2011.01); H01R 12/69 (2011.01); H05K 1/11 (2006.01); G02F 1/21 (2006.01); G02F 1/225 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H01R 12/62 (2013.01); H01R 12/69 (2013.01); H05K 1/0219 (2013.01); H05K 1/113 (2013.01); H05K 1/118 (2013.01); G02F 1/2255 (2013.01); G02F 2001/212 (2013.01); H05K 1/0225 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/09354 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09736 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10303 (2013.01);
Abstract

An optical device includes a connection pad, which is connected to a conductor pattern on the circuit substrate, at one edge. The connection pad includes one ground pad, and two or more signal pads between which the ground pad is interposed from its both sides. The ground pad includes a concave portion including an opening at the edge. The circuit substrate is provided with a metal columnar member in the conductor pattern to which the ground pad is connected. The conductor pattern and the connection pad are fixed to each other with solder in a state in which the columnar member is fitted into the concave portion. Solder, which gradually rises from the ground pattern to a lateral surface of the columnar member, is formed between the columnar member and the ground pattern that is formed in the flexible printed circuit.


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