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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10091867 B1

PDFFull Text
Date of Patent:
Oct. 02, 2018

Filed:

Jan. 11, 2017

Led lighting assemblies with thermal overmolding

Applicants:

Jeffrey Nall, Brecksville, OH (US);

Matthew Mrakovich, Streetsboro, OH (US);

Inventors:

Jeffrey Nall, Brecksville, OH (US);

Matthew Mrakovich, Streetsboro, OH (US);

Assignee:

GE LIGHTING SOLUTIONS LLC, Cleveland, OH (US);

Attorney:

Fay Sharpe LLP

Primary Examiner:

Donghai D Nguyen

Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/02 (2006.01); F21V 9/30 (2018.01); F21V 3/10 (2018.01); F21V 29/00 (2015.01); G09F 9/33 (2006.01); H05K 3/28 (2006.01); F21V 9/16 (2006.01); F21V 23/00 (2015.01); F21V 29/70 (2015.01); F21V 29/85 (2015.01); F21V 23/02 (2006.01); F21S 4/10 (2016.01); F21S 4/20 (2016.01); F21K 9/90 (2016.01); F21V 3/02 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); F21V 3/12 (2018.01); F21V 31/04 (2006.01); F21V 3/04 (2018.01); F21Y 101/00 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); F21K 9/90 (2013.01); F21S 4/10 (2016.01); F21S 4/20 (2016.01); F21V 3/02 (2013.01); F21V 3/10 (2018.02); F21V 9/16 (2013.01); F21V 9/30 (2018.02); F21V 23/001 (2013.01); F21V 23/005 (2013.01); F21V 23/007 (2013.01); F21V 23/023 (2013.01); F21V 29/004 (2013.01); F21V 29/70 (2015.01); F21V 29/85 (2015.01); G09F 9/33 (2013.01); H05K 1/0209 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 3/32 (2013.01); F21V 3/0481 (2013.01); F21V 3/12 (2018.02); F21V 31/04 (2013.01); F21Y 2101/00 (2013.01); F21Y 2115/10 (2016.08); H05K 2201/0129 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/1316 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49146 (2015.01);
Abstract

One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.

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