The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Feb. 10, 2017
Applicants:

Tennvac Inc., New Taipei, TW;

Tennmax America Inc., Vancouver, WA (US);

Inventors:

Pai-Lee Chang, New Taipei, TW;

Guan-Yu Chen, New Taipei, TW;

Assignees:

Tenn Vac Inc., New Taipei, TW;

TennMax America Inc., Vancouver, WA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/12 (2006.01); C09J 5/04 (2006.01); C09J 123/06 (2006.01); H01P 11/00 (2006.01); H01P 1/04 (2006.01);
U.S. Cl.
CPC ...
H01P 3/12 (2013.01); C09J 5/04 (2013.01); C09J 123/06 (2013.01); H01P 1/042 (2013.01); H01P 11/002 (2013.01); C09J 2201/602 (2013.01); C09J 2423/04 (2013.01);
Abstract

The present invention provides a method of manufacturing a waveguide assembly and a structure thereof, wherein the manufacturing method comprises the steps of: providing at least two waveguide units and combining the waveguide units, wherein each waveguide unit has at least one bonding portion formed at a position where each two said waveguide units are combined; and at least one adhesive is applied to the bonding portion to combine the waveguide units into the waveguide assembly. With the practice of the present invention, many advanced functions such as rapid design, rapid manufacture, rapid verification and cost reduction can be achieved.


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