The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Nov. 25, 2015
Applicant:

Sharp Kabushiki Kaisha, Sakai, Osaka, JP;

Inventor:

Kenji Misono, Sakai, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Sakai, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); G02F 1/1333 (2006.01); G02F 1/1339 (2006.01); G09F 9/00 (2006.01); G09F 9/30 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); G02F 1/1333 (2013.01); G02F 1/1339 (2013.01); G09F 9/00 (2013.01); G09F 9/30 (2013.01); H01L 51/003 (2013.01); H01L 51/0096 (2013.01); H01L 51/0097 (2013.01); H01L 51/5246 (2013.01); G02F 1/133305 (2013.01); G02F 1/133351 (2013.01); G02F 2201/56 (2013.01); H01L 2227/326 (2013.01);
Abstract

A method includes a supporting step supporting first planar surfaces of two substratesA andA having flexibility with supporting boardsandeach having flexibility and a larger thickness than the two substratesA andA, a thin film pattern formation step, after the supporting step, forming a thin film pattern on second planar surfaces of the two substratesA andA, a bonding step, after the thin film pattern formation step, bonding the two substratesA andA at surfaces each having the thin film pattern thereon with the sealant therebetween to form a bonded substrate, a first curving step, after the bonding step, curving the bonded substratewhile curing the sealant, a detachment step, after the first curving step, detaching the supporting boardsandfrom the bonded substrate, and a second curving step, after the detachment step, further curving the bonded substrate


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