The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2018
Filed:
Mar. 02, 2015
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventor:
Naoyuki Komuta, Oita Oita, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H01L 23/00 (2006.01); B23K 3/047 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); B23K 1/0016 (2013.01); B23K 3/0478 (2013.01); H01L 24/75 (2013.01); H01L 24/13 (2013.01); H01L 2224/131 (2013.01); H01L 2224/7592 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/75502 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75802 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/75822 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/8115 (2013.01); H01L 2224/8116 (2013.01); H01L 2224/8117 (2013.01); H01L 2224/8118 (2013.01); H01L 2224/81048 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81948 (2013.01); H01L 2924/3841 (2013.01);
Abstract
A manufacturing apparatus of a semiconductor device includes a stage, a head unit configured to face the stage, a driving unit configured to move the head unit towards and away from the stage, a heating unit configured to heat the head unit, and a control unit configured to control the driving unit to move the head unit away from the stage when the heating unit heats the head unit.