The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Feb. 08, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Ayanori Ikoshi, Kyoto, JP;

Masahiro Hikita, Toyama, JP;

Keiichi Matsunaga, Toyama, JP;

Takahiro Sato, Toyama, JP;

Manabu Yanagihara, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3171 (2013.01); H01L 23/291 (2013.01); H01L 23/3192 (2013.01); H01L 23/528 (2013.01); H01L 23/564 (2013.01); H01L 24/05 (2013.01); H01L 29/0684 (2013.01); H01L 29/417 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05014 (2013.01); H01L 2224/05023 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05169 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/48463 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1304 (2013.01);
Abstract

A semiconductor device includes a substrate; a semiconductor layer; a first protective film; a first adhesive layer disposed on the first protective film; an electrode pad disposed on the first protective film; a second protective film disposed to cover and be in contact with the electrode pad and the first adhesive layer; and a first opening formed in part of the second protective film such that the upper surface of the electrode pad is exposed, wherein in a plan view, the first adhesive layer includes a first projection projecting from the electrode pad radially in a direction of the periphery of the electrode pad and continuously surrounding the periphery of the electrode pad; and the second protective film is continuously to cover and contact part of the upper and side surfaces of the electrode pad, the upper and side surfaces of first projection, and the first protective film.


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