The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2018
Filed:
Jan. 11, 2017
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Andrew Christopher Graeme Wood, St.Jakob i. Rosental, AT;
Gernot Fasching, Villach, AT;
Marius Aurel Bodea, Villach, AT;
Thomas Krotscheck Ostermann, Koestenberg, AT;
Erwin Bacher, Villach, AT;
Assignee:
INFINEON TECHNOLOGIES AUSTRIA AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 23/485 (2006.01); H01L 23/482 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); G06F 17/5072 (2013.01); H01L 21/78 (2013.01); H01L 22/14 (2013.01); H01L 22/32 (2013.01); H01L 23/485 (2013.01); H01L 23/4827 (2013.01); H01L 23/528 (2013.01); H01L 23/53271 (2013.01); H01L 23/585 (2013.01); H01L 24/05 (2013.01); H01L 2224/0518 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05157 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05169 (2013.01); H01L 2224/05172 (2013.01); H01L 2224/05184 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/146 (2013.01);
Abstract
A semiconductor die includes a semiconductor circuit disposed within or over a substrate. A conductive contact pad is disposed over the substrate outside the semiconductor circuit. A floating electrical path ends at a singulated edge of the die. The electrical path is electrically coupled to the conductive contact pad.