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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10090198 B1

PDFFull Text
Expired
Date of Patent:
Oct. 02, 2018

Filed:

Aug. 06, 2014

Method for separating substrates and semiconductor chip

Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventor:

Mathias Kaempf, Burglengenfeld, DE;

Assignee:

OSRAM Opto Semiconductors GmbH, Regensburg, DE;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Aaron Gray

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/544 (2006.01); H01L 21/78 (2006.01); B23K 26/354 (2014.01); B23K 26/53 (2014.01); B23K 26/00 (2014.01); H01L 21/225 (2006.01); H01L 21/24 (2006.01); H01L 21/268 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 33/00 (2010.01); H01L 31/00 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/0006 (2013.01); B23K 26/0057 (2013.01); B23K 26/0081 (2013.01); B23K 26/354 (2015.10); B23K 26/53 (2015.10); H01L 21/225 (2013.01); H01L 21/24 (2013.01); H01L 21/268 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 31/00 (2013.01); H01L 33/0095 (2013.01); B23K 2203/30 (2015.10); B23K 2203/56 (2015.10);
Abstract

Disclosed is a method for separating a substrate () along a separation pattern (), in which method a substrate () is provided and an auxiliary layer () is applied to the substrate, said layer covering the substrate at least along the separation pattern. The substrate comprising the auxiliary layer is irradiated, such that the material of the auxiliary layer penetrates the substrate along the separation pattern in the form of an impurity. The substrate is broken along the separation pattern. A semiconductor chip () is also disclosed.

Find Patent Forward Citations

Kaempf, Mathias. (2018). Method for separating substrates and semiconductor chip (U.S. Patent No. 10090198). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10090198

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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