The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2018
Filed:
Jun. 24, 2013
Applicant:
Scientific Value Solutions Co. Ltd, Anseong-si, KR;
Inventor:
Jin Woo Lee, Pyeongtaek-si, KR;
Assignee:
SCIENTIFIC VALUE SOLUTIONS CO. LTD, Anseong-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); C25D 17/00 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6708 (2013.01); C25D 17/001 (2013.01); C25D 17/004 (2013.01); H01L 21/6719 (2013.01); H01L 21/6833 (2013.01); H01L 21/68764 (2013.01); H01L 21/68785 (2013.01); H01L 21/2885 (2013.01); H01L 21/76898 (2013.01);
Abstract
An apparatus for manufacturing a semiconductor wafer comprises: a wafer chuck which holds the rear surface of a wafer having a via hole; a cap which is installed in such a way as to move up and down above the wafer chuck and has a sealed lip which forms a liquid reservoir by sealing the outer peripheral portion of the upper surface of the wafer; and a nozzle which injects and recovers processing liquids to and from a reaction chamber.