The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Jan. 02, 2015
Applicant:

Analogic Corporation, Peabody, MA (US);

Inventors:

Ruvin Deych, Gloucester, MA (US);

Daniel Abenaim, Lynnfield, MA (US);

Assignee:

ANALOGIC CORPORATION, Peabody, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/11 (2006.01); G21K 1/00 (2006.01); G21K 1/02 (2006.01); B22F 3/00 (2006.01); B29C 70/58 (2006.01); B29C 64/141 (2017.01); B41M 3/00 (2006.01); B33Y 10/00 (2015.01); B29K 103/06 (2006.01); B29K 505/08 (2006.01); B29L 11/00 (2006.01); B29L 31/34 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
G21K 1/00 (2013.01); B22F 3/008 (2013.01); B29C 64/141 (2017.08); B29C 70/58 (2013.01); G21K 1/025 (2013.01); B29K 2103/06 (2013.01); B29K 2505/08 (2013.01); B29L 2011/00 (2013.01); B29L 2031/34 (2013.01); B29L 2031/737 (2013.01); B33Y 10/00 (2014.12); B41M 3/00 (2013.01);
Abstract

One or more metal printing techniques are described for generating a three-dimensional metal structure, such as a one-dimensional or two-dimensional anti-scatter grid. The techniques comprise applying a thin layer of powdered metal onto a printing area and using a binder (which is printed onto the printing area according to a specified pattern) to bind the powdered metal particles together. The acts of applying powdered metal and a binder may be repeated a plurality of times until a three-dimensional metal structure having a specified height is created. Moreover, in one embodiment, once the layering is complete, another binder is applied to the one or more layers to provide strength and/or support. While heat may be used in some embodiments to activate one or more of the applied binders the three-dimensional metal structure is generally not heated to a melting point of the powdered metal.


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