The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2018
Filed:
Mar. 10, 2017
Test board for semiconductor package, test system, and method of manufacturing semiconductor package
Samsung Electronics Co., Ltd., Suwon-si, KR;
Joo-sung Yun, Asan-si, KR;
Woon-sup Choi, Asan-si, KR;
Moon-ho Lee, Asan-si, KR;
Seong-seob Shin, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A test board includes: a board substrate; a device under test (DUT) socket connected to the board substrate and configured to accommodate a semiconductor package; a test controller; a wireless signal unit configured to wirelessly exchange signals with a server; and a wireless power unit configured to be wirelessly charged by an external source and configured to supply electric power to the test controller and the DUT socket, wherein the test controller is configured to independently perform a test on the semiconductor package accommodated in the DUT socket in response to a test pattern command being wirelessly received from the server via the wireless signal unit.