The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Apr. 30, 2014
Applicant:

Wistron Neweb Corp., Hsinchu, TW;

Inventors:

Babak Radi, Hsinchu, TW;

Shih-Hong Chen, Hsinchu, TW;

Yu-Fu Kuo, Hsinchu, TW;

Chun-Lin Chen, Hsinchu, TW;

Jing-Wen Chen, Hsinchu, TW;

Assignee:

Wistron NeWeb Corp., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 23/498 (2006.01); G03F 7/20 (2006.01); H01L 23/06 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 3/02 (2006.01); B32B 3/30 (2006.01); H05K 3/10 (2006.01); H05K 3/24 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1605 (2013.01); B32B 3/02 (2013.01); B32B 3/30 (2013.01); B32B 15/043 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); C23C 18/182 (2013.01); G03F 7/202 (2013.01); H01L 23/06 (2013.01); H01L 23/49838 (2013.01); H01L 23/528 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 23/5228 (2013.01); H01L 23/53204 (2013.01); H01L 23/53228 (2013.01); H01L 23/53233 (2013.01); H01L 23/53242 (2013.01); H05K 3/107 (2013.01); H05K 3/243 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2255/24 (2013.01); B32B 2457/00 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01); H05K 1/09 (2013.01); H05K 3/0026 (2013.01); H05K 2201/0338 (2013.01); H05K 2203/072 (2013.01); Y10T 428/12361 (2015.01); Y10T 428/24331 (2015.01);
Abstract

The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.


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