The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2018
Filed:
Mar. 27, 2015
Nippon Paper Industries Co., Ltd., Tokyo, JP;
Naoki Andoh, Yokohama, JP;
Masao Takahashi, Isesaki, JP;
Yoshihiro Yamaguchi, Koshigaya, JP;
Yasutaka Watanabe, Tokyo, JP;
Kenichi Fujino, Tokyo, JP;
Masayoshi Miki, Iwakuni, JP;
NIPPON PAPER INDUSTRIES CO., LTD., Tokyo, JP;
Abstract
A multilayer composite body in which a shaped metal article, a thermosetting resin layer, a modified polyolefin resin layer, and a polypropylene-based resin composition, or a PP-based GFRTP are laminated in the order of description. A multilayer composite body of a metal and a resin is obtained which excels in a fixing strength (shear breaking stress) between the shaped metal article and the molded article of the polypropylene-based resin composition. The thermosetting resin layer is composed mainly of a urethane resin or an epoxy resin. The polypropylene-based resin composition is molded by an injection molding. The modified polyolefin resin forming the modified polyolefin resin layer includes one or two or more of non-chlorinated modified polyolefin resins having a weighted average of melting points of 70° C. to 110° C., as determined with a differential scanning calorimeter (DSC).