The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Mar. 26, 2010
Applicants:

Takaaki Okamura, Yamaguchi, JP;

Hiroaki Togo, Yamaguchi, JP;

Takashi Sugimura, Yamaguchi, JP;

Inventors:

Takaaki Okamura, Yamaguchi, JP;

Hiroaki Togo, Yamaguchi, JP;

Takashi Sugimura, Yamaguchi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 5/00 (2006.01); B21D 22/28 (2006.01); B21D 35/00 (2006.01); B21D 51/26 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B21D 22/28 (2013.01); B21D 35/005 (2013.01); B21D 51/26 (2013.01); B32B 15/20 (2013.01); B05D 2202/25 (2013.01); B05D 2252/10 (2013.01); B05D 2701/10 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2439/66 (2013.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01);
Abstract

Provided is a composite Al material for a drawn and ironed can from which a drawn and ironed can having brightness can be formed. In a resin coated metal plate used for forming a drawn and ironed can, a first resin layer () having a thickness of 0.02 to 2 μm is formed on a surface of an Al platewhich forms an outer surface of the can, and a second resin layerhaving a thickness of 1 to 40 μm is formed on a surface of the Al platewhich forms an inner surface of the can. In a penetration test using a TMA device, an insertion amount of a quartz pin when a load of 5 g is applied to the first resin layer at a temperature of 100° C. is 20% or less of a film thickness of the first resin layer. Further, the first resin layer has a room temperature of 10 N/mmor more.


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