The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Aug. 30, 2013
Applicant:

Brooks Automation, Inc., Chelmsford, MA (US);

Inventor:

Peter van der Meulen, Newburyport, MA (US);

Assignee:

Brooks Automation, Inc., Chelmsford, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B25J 9/04 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
B25J 9/042 (2013.01); H01L 21/6719 (2013.01); H01L 21/67126 (2013.01); H01L 21/67161 (2013.01); H01L 21/67167 (2013.01); H01L 21/67173 (2013.01); H01L 21/67178 (2013.01); H01L 21/67184 (2013.01); H01L 21/67196 (2013.01); H01L 21/67201 (2013.01); H01L 21/67207 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); H01L 21/67727 (2013.01); H01L 21/67733 (2013.01); H01L 21/67736 (2013.01); H01L 21/67742 (2013.01); H01L 21/67745 (2013.01); H01L 21/67748 (2013.01); H01L 21/67754 (2013.01); H01L 21/67757 (2013.01); H01L 21/67781 (2013.01); H01L 21/68 (2013.01); H01L 21/68707 (2013.01); H01L 21/68735 (2013.01); Y10S 414/135 (2013.01); Y10S 414/137 (2013.01);
Abstract

Linear semiconductor handling systems provide more balanced processing capacity using various techniques to provide increased processing capacity to relatively slow processes. This may include use of hexagonal vacuum chambers to provide additional facets for slow process modules, use of circulating process modules to provide more processing capacity at a single facet of a vacuum chamber, or the use of wide process modules having multiple processing sites. This approach may be used, for example, to balance processing capacity in a typical process that includes plasma enhanced chemical vapor deposition steps and bevel etch steps.


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