The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2018
Filed:
May. 29, 2015
Meidensha Corporation, Tokyo, JP;
Kaoru Kitakizaki, Saitama, JP;
Keita Ishikawa, Tokyo, JP;
Shota Hayashi, Tokyo, JP;
Nobutaka Suzuki, Kodaira, JP;
MEIDENSHA CORPORATION, Tokyo, JP;
Abstract
A process for producing an electrode material by infiltrating a highly conductive metal such as Cu into a porous object containing heat-resistant elements. Before an infiltration step in which the highly conductive metal is infiltrated, a HIP treatment is given to a powder containing the heat-resistant elements (or to a molded object obtained by molding a powder containing the heat-resistant elements). The composition is controlled so that the HIP treatment yields a porous object which has a degree of filling of 70% or higher, more preferably 75% or higher. The highly conductive metal is infiltrated into the porous object having the controlled composition.